About Microwave Packaging Technology, Inc.

Microwave Packaging Technology, Inc (MPT) provides packaging solutions and product development services.

Our mission is to provide superior solutions for microwave and millimeter-wave products. We believe that packaging issues are a central challenge in developing products above 1GHz. Whether the product is a IC package or a radar T/R module, packaging is usually central to achieving performance and cost goals.

Our IC packaging solutions are unique in that we are not tied to one particular material solution. We apply the correct material solution to each application to achieve customer requirements. We have provided ceramic, laminate, liquid crystal polymer, plastic and PCB solutions. Our ceramic solutions include alumina, LTCC, mixed material (metal and ceramic) and AlN. Package configurations are BGA, leadless, hermetic and non-hermetic.

Our product development services include custom modules, system in a package (SIP), subsystems and multi layer circuit boards. Our solutions are in a wide range of systems including high speed applications at 10 & 40Gb/S, wireless, point to point, satellite, radar and communication networks.

Since starting business in 2003 we have provided our customer with superior solutions.