GaAs MMICs for Commerical and Military Applications
MPT's team has extensive experience in the development of MMICs. Though our experience covers a broad range including point to point systems, wireless networks and communication systems, the majority of our integrated circuit experience is in phased arrays.
Our MMIC development capability benefits our customers two ways.
Our team has developed face up MMICs and Flip chip MMICs. The flip chip solutions are particularly useful for millimeter-wave applications where interconnection inductance from wire bonds can become too large. Flip chips can provide low inductance interconnect to 80GHz.
Listed below are just a few examples of MMIC chips developed by the MPT Team.
Common Leg (CLC MMIC)