MPT provides full product development for custom and semi-custom products. Our unique capabilities allow us to provide turn-key product development from concept to delivery of production quantities.
Modules: Traditional metal housing microwave modules, less traditonal modules using surface mount packages.
System In A Package (SIP): Our SIP solutions include ceramics such as LTCC and Alumina, laminate and LCP. Typically they contain multiple ICs, integrated passives and buried components.
Subsystems: Subsystem solutions for communication, radar, point to point, radio and wiresless.
