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Integrated Circuit and MMIC Packaging
Without the right package, even a break through RF/microwave component will not perform correctly. This is due to the fact that high frequency applications require packaging solutions which do not degrade the rf signal path.
Our customers come to us for their solutions. The Microwave Packaging Technology Advantage is based upon a solid understanding of interconnects, transitions, materials and manufacturing at microwave and millimeter-wave frequencies. Our depth of knowledge and experience in these areas allow us to provide packaging solutions for RFICs, MMICs, filters, antennas, couplers, baluns, SIP, GaAs, SiGe, GaN and SiC.
Integrated Circuit and MMIC Packaging:
Package Type |
Part Number & Description |
Image |
Frequency Range |
Lid Type |
Size |
| Hermetic QFN |
MQFN1001 Ceramic QFN |
 |
DC to 30GHz | Kovar |
5mm and up |
| Hermetic QFN | Ceramic and Kovar |
 |
DC to 5GHz | Seam Seal |
10mm and up |
| Hermetic SMT |
MLP1001 Ceramic and Kovar |
 |
DC to 10GHz | Seam Seal |
0.450" x 0.450" |
| Non-Hermetic | MQFN1002A Ceramic |
 |
DC to 20GHz | B-Stage Plastic | 4mm and up |
| Non-Hermetic |
MQFN1002B |
 |
DC to 40GHz | B-Stage Plastic | 4mm and up |
