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MLP1001
Our TO8 style hermetic package will meet your requirement for a hermetic package or module for applications from DC to 11GHz.
We offer our standard size of 0.450" x 0.450" but we can customize to nearly any size package and die bonding arrangement.
We provide full service of the package, assembly and test. We will attach your integrated circuits, MMICs, passives and other circuits. Then we will wire bond and perform pre-seal testing. Hermetic sealing ensures that your package will meet high reliability requirements. Finally, we will perform electrical tests to your specifications and confirm your performance requirements.
We understand your requirements for MMIC packaging.
