OUR SERVICES

Integrated Circuit and MMIC Packaging

Without the right package, even a break through RF/microwave component will not perform correctly. This is due to the fact that high frequency applications require packaging solutions which do not degrade the rf signal path.

Our customers come to us for their solutions. The Microwave Packaging Technology Advantage is based upon a solid understanding of interconnects, transitions, materials and manufacturing at microwave and millimeter-wave frequencies. Our depth of knowledge and experience in these areas allow us to provide packaging solutions for RFICs, MMICs, filters, antennas, couplers, baluns, SIP, GaAs, SiGe, GaN and SiC.

Modules

Successful module development requires in depth knowledge of the issues facing microwave and millimeter-wave products. A few significant issues are manufacturing and test processes, coupling, resonance, hybrid circuits, chip and wire issues, surface mount devices, thick/thin film, ceramics and laminates. MPT has successfully delivered low noise amplifiers, high power modules, transmit/receive modules, down converter, and physical layer products. The MPT markets for modules are telecom, military, and satellite.

Sub Systems

If you require a microwave or millimeter-wave sub system with multiple functions, you are likely familiar with the challenges. Our system engineering experience allows us to deliver sub-systems with multiple functions such as synthesizer (PLL or Frac-N), up/down converters, amplifiers, filtering, phase shifters and couplers.