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Module Capabilities

Our customers benefit from choosing MPT because they win twice. First, our customers win because we deliver the solutions they ask for. Second, our customers benefit because our processes result in very efficient solutions. We achieve this by using the best practices such as extensive use of 3D electromagnetic analysis (HFSS), 3D computer aided mechanical design (Solid Works), electrical circuit design using time domain and frequency domain simulation (Microwave Office). Furthermore, our test and evaluation capabilities include vector network analyzers, probe station and spectrum analyzers.

3D Electromagnetic Analysis.

How does the fact that MPT uses 3D electromagnetic analysis benefit our customers? At MPT, we have developed an extensive library of transitions and interconnects which allow for the highest level of performance without over engineering the solution. This allows us to efficiently apply the correct connectors, pin to substrate interconnect, wire bond compensation networks and package connections with an excellent track record of getting it right the first time.

Figure. 3D view of ceramic module transition.

Figure. HFSS model of an IC package with leads.

Figure. Eye diagram performance from a 3D electromagnetic analysis.

Figure. 3D image of a HFSS model and the performance plot showing the return loss.

3D Mechanical Modeling

With our knowledge in the Defense, Aerospace, Optoelectronics, Space, Telecommunications, we can help you avoid problems with up-front engineering excellence. Our customer wins as a result because you will receive a product that is designed for manufacturability and that it will meet your requirements. Using state of the art 3D modeling and drafting techniques. We use parametric attributes that can always insure better fist article units. From small QFN’s to large scale systems and sub systems, the “3D physical models are always the most accurate and efficient”.
Furthermore, the resulting design database translates directly into manufacturing. This means less human interface in programming and less human errors. The result: more efficient product development and production.
The efficiency of this system if further enhanced by the fact that with 3D models we can thoroughly evaluate every aspect of your design prior to final artwork preparation. Careful attention can be paid to component sizes and placement, pin-out and circuit routing, component and traces interference, thermal and mechanical constraints. The design will be optimized to both your prototype requirements as well as the needs for production units.

Figure 1. 3D model of one of our modules realized in Solid Works.