Free Software

Multi Detailed Software Description Down Load Now

Features User friendly Windows interface Fast simulation time User configurable convergence parameter Control dielectric constant and layer thickness for all four dielectric materials Control transmission line width Predicts Line Impedance (ohms) Effective Dielectric Constant Electrical Length (degrees) Electrical Delay (pico seconds) Line Capacitance (pF/m) Line Inductance (nH/m)

Thermal Detailed Software Description Down Load Now

Features Thermal is an analysis tool for packages and modules. It is useful for predicting the temperature rise in a stack of different materials. The user is able to specify the type of heat source. For an ideal heat source with a rectangular surface area the software predicts the temperature at the heat source interface, temperature rise in each layer and the thermal resistance of the stack. For a heat source such as a MMIC or packaged die the software predicts junction temperature (with user supplied junction to case thermal resistance), temperature rise in each layer and the thermal resistance of the stack. Thermal uses the area of the heat source and material parameters of each layer to determine the temperature rise in each layer. The user is able to specify either a 45 or 0 degree spreading angle. It uses a straight forward method to determine the temperature rise in each layer. It uses the familiar relationship dT=Q*t/(TC*A) where dT is the temperature rise, Q is the heat source, t is the thickness of the layer and A is the area of the heat source.