T/R Modules

MPT personnel have extensive experience developing T/R modules. We have developed T/R modules for military and commercial radar systems. We are able to support the development of brick style or tile array style T/R modules.

For tile array modules, our team has developed solderless interconnects using fuzz button interconnects to allow for stacked 3D modules. The resulting module is smaller and is able to achieve much higher packaging density than the brick array approach.

In addition to the traditional brick or tile array, MPT has experience developing low cost flat panel arrays. Rick Sturdivant, President of MPT, presented at a Georgia Tech course on T/R modules. Take a look at a portion of his educational presentation.

Tile Arrays

MPT personnel have developed tile array modules and panel arrays. The figure below illustrates a tile array. Tile array rely on several key technologies:

1) Solderless interconnects
2) Stacked substrates
3) High thermal conductivity substrate for heat transfer from HPA MMICs.
4) Direct contact to array level cold plate near the radiators.

Illustration of a Tile Array stack up