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MPT White Papers and Design Notes
 
White Paper Title
Mini Abstract
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Millimeter-wave Ceramic QFN IC Packages
30GHz Ceramic QFN
IC Package For Microwave
MEMS Device
Package for a MEMS RF Switch
Microwave Hybrid Capability Ku Band Mixer
Design of a singly balanced hybrid Ku band mixer using low cost SMT diodes on a laminate board.
Custom Filter Design
Outlines some of the MPT capability for custom filter development
System In a Package (SIP) 3D transition, interconnects and buried components such as filters. System In A Package
Design Note 001: Transmission Line Dispersion Effects On Signal Integrity A discussion on the effects of dispersion on the transmission of signals Design Note 001
Microstrip Design Tips Web page with tips for design of microstrip lines. Microstrip
X-Band Package
Design and Test		 Design and test of a 10GHz package X Band Package
Design Note 002: Design For Packageability
A discussion on the importance of designing the package in parallel with the IC
 
 
9/29/08 - MPT announces new IC package product

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Customer Testimonials
 
“MPT has been a key element in the success of several product lines.”
Clay Kucenas
President, Microplex, Inc.
 
Free Software
 
Multi - Variational Method analysis of transmission lines. More »

Thermal - Predicts junction temp. in electronics. More »
 
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