It may come as a surprise to many, but heat transfer design is one of the most important tasks in a proper phased array design. The reason is simple–Without solid heat transfer, the electronics in the phased array will not be reliable. The result may be that components such as high power amplifiers will begin to fail which can cause total failure of your phased array.
For this reason, MPT uses state of the art thermal simulation tools to predict the junction temperatures of the electronics. We use this information, along with other proprietary analysis methods, to calculate the expected mean time before failure (MTBF) for the product.
The image below is of a transmit/receive module developed by MPT. It contains high power amplifiers, low power amplifiers, and other electronics.
If you would like to know more about how MPT can supply your next phased array solution, then reach out to us today: firstname.lastname@example.org or (951) 252-6336.